High density Plasma CVD Research Paper Example | Topics and Well Written Essays - 2500 words

High density Plasma CVD - Research Paper Example These include silicon, carbon, nitrites, carbides, oxides and also many others. In semi-conductor world, CVT is majorly used in the fabrication process of the semiconductor devices and to the exposure of the amorphous SiO2, Silicon Germanium and tungsten etc. The CVD is also the cause of the production of synthetic diamonds. The major importance of CVD in the industry lies in the fact that this process uses the gases as reactants. So the gas’s properties give much support to the reaction procedures. CVD is far most the best and reliable deposition phenomenon/process present. Its advantages include Versatile in nature – any element can be deposited either metallic or non-metallic About 99.99-99.999% pure results Formation of the material less than the melting point Nearly 100% density Economical There exist various types of Chemical Vapor Deposition. These include Atmospheric pressure CVD (APCVD), Aerosol Assisted CVD (AACVD), Hot Wire (HWCVD), Atomic Layer CVD (ALCVD), Low Pressure CVD (LPCVD), Metal Organic CVD (MOCVD), Plasma Enhanced CVD (PECVD) Rapid Thermal CVD (RTCVD), Remote Plasma Enhanced CVD (RPECVD), Microwave Plasma Assisted CVD (MPACVD) and Ultra High Vacuum CVD (UHVCVD). Introduction to High Density Plasma CVD Now I will start a proper introduction of the High Density Plasma Chemical vapor deposition HDP-CVD). The HDP-CVD process is majorly used for the dielectric gap filling in semiconductor devices manufacturing at very micro level. It is used for the Shallow Trench Isolation (STI) and the dielectrics inter layers in 180-nm, 130-nm and 90-nm technologies. Hope fully it will start for the 65-nm and 45-nm technologies too. Gap fillings at such a small scale are very difficult task. While doing the edge gap filling some factors are also keep in consideration like raising the wafer temperature, plasma density and lowering of the deposition pressure. The reaction chamber is used for the process. Scientists have developed the new generat ion tools for the higher plasma density. The HDP reaction chamber is included the two sources of the radio frequency (RF). These are coupled with the plasma as inductively and capacitively. Inductive RF controls the plasma density and capacitive RF controls the physical bombardment of ions to the wafers or substrates. The reaction chamber will be discussed in detail later on. HDP-CVD gives improved characteristics for the gap filling in the semiconductor fabrication. A process is explained here as an example. A semiconductor material or substrate is loaded in the reaction process chamber. The high density plasma is generated by the gases including oxygen, silicon, hydrogen and a chemical etching gas which is nitrogen free. This plasma is generated exactly on the substrate semiconductor. After this process the chemical semiconductor substrate is heated to a very high temperature. Normally it ranges from the 550 degree Celsius to 700 degree Celsius. This procedure helps in filling the gap regions without any side effects to the substrate. The layer for filling the gaps is of the silicon oxide. Fabrication Process The process of the high density plasma CVD comprised of the different claims which are as follows The steps which involved in the high density

Summary Essay Example | Topics and Well Written Essays - 500 words - 59

Summary - Essay Example in a competitive edge by developing a treatment drug for Alzheimer’s disease, of which 18 million people suffer around the world, Pfizer decided in 2008 to give Medivation a large amount of $225 million and $500 million more if it was able to successfully produce Dimebon. The feasibility of the drug as well as the extravagance of the deal were widely criticized, though past evidence from Russia suggested that the development of such a drug was possible. However, when the drug was tested by introducing it to moderate Alzheimer’s patients in phase 3 trials, it failed to achieve the expected goals. Consequently, with the termination of the partnership contract, the dreams of the two companies to gain a substantial edge in the Pharmaceutical industry collapsed too. Since Medivation used to rely heavily on its partnership with Pfizer to generate returns, the extinction of the agreement has resulted in more serious financial losses for Medivation in contrast to Pfizer. This is certainly not a good signal for Medivation as well as Pfizer. The stoppage of the development of Dimebon has caused financial setbacks to both the companies. During the first three quarters of 2011, Medivation’s shares have dropped drastically by 3.3%. At the same time, Pfizer’s stock rose only slightly by 0.4%. The plans of the two companies to become future leaders in the market have crashed along with their product. Consequently, the financial outcomes are bound to remain low for at least sometime in the future. As far as the competitors of the two companies are concerned, they have been presented with a very good opportunity to gain an edge in the market. The competitors are already aware of the significance which Alzheimer’s drug holds and the amount of sales it could trigger. Moreover, information about the failure of Medivation and Pfizer in phase 3 trial will result in competitors being further careful in developing the product and avoiding the mistakes which were committed by